JPH0636589Y2 - 樹脂封止型電子機器 - Google Patents
樹脂封止型電子機器Info
- Publication number
- JPH0636589Y2 JPH0636589Y2 JP1989002731U JP273189U JPH0636589Y2 JP H0636589 Y2 JPH0636589 Y2 JP H0636589Y2 JP 1989002731 U JP1989002731 U JP 1989002731U JP 273189 U JP273189 U JP 273189U JP H0636589 Y2 JPH0636589 Y2 JP H0636589Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- storage cup
- resin
- sealing resin
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 claims description 28
- 239000011347 resin Substances 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 26
- 238000007789 sealing Methods 0.000 claims description 24
- 239000004065 semiconductor Substances 0.000 claims description 16
- 239000008188 pellet Substances 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989002731U JPH0636589Y2 (ja) | 1989-01-17 | 1989-01-17 | 樹脂封止型電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989002731U JPH0636589Y2 (ja) | 1989-01-17 | 1989-01-17 | 樹脂封止型電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0295257U JPH0295257U (en]) | 1990-07-30 |
| JPH0636589Y2 true JPH0636589Y2 (ja) | 1994-09-21 |
Family
ID=31203759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989002731U Expired - Fee Related JPH0636589Y2 (ja) | 1989-01-17 | 1989-01-17 | 樹脂封止型電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0636589Y2 (en]) |
-
1989
- 1989-01-17 JP JP1989002731U patent/JPH0636589Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0295257U (en]) | 1990-07-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |